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精品推薦 | 倒裝芯片貼合機(jī)

2023-11-08 16:17

優(yōu)點(diǎn)介紹

Advantages

熱親和柔性設(shè)計(jì)，高效貼裝無(wú)極限

設(shè)備整體采用熱親和柔性設(shè)計(jì)，在保證產(chǎn)品整體產(chǎn)能的同時(shí)，能極大提高產(chǎn)品的貼裝精度；在關(guān)閉UP LOOK相機(jī)的情況下，設(shè)備產(chǎn)能可達(dá)5000PCS/h以上，在開(kāi)啟UP LOOK相機(jī)的情況下，可達(dá)3000PCS/h以上，同時(shí)它能保證貼合精度在±7μm（3δ）之內(nèi)。

The overall equipment adopts a hot affinity flexible design, which can greatly improve the installation accuracy of the product while ensuring its overall production capacity; The equipment production capacity can reach over 5000PCS/h when the up look camera is turned off, and over 3000PCS/h when the up look camera is turned on. At the same time, it can ensure a fitting accuracy of ± 7 μ M (3 δ） Within.

一機(jī)多能，兼容三種封裝工藝

設(shè)備兼容芯片正裝、芯片倒裝、芯片堆疊封裝三種封裝工藝；配備擺動(dòng)旋轉(zhuǎn)機(jī)構(gòu)和翻轉(zhuǎn)機(jī)構(gòu)，使設(shè)備能同時(shí)兼容正裝和倒裝兩類不同的貼裝工藝。配備UplookAlign和Postbond功能，Postbond功能支持實(shí)時(shí)動(dòng)態(tài)檢測(cè)和動(dòng)態(tài)補(bǔ)償，進(jìn)一步確保了產(chǎn)品貼裝的精度和穩(wěn)定性。

The device is compatible with three packaging processes: chip forward packaging, chip flip packaging, and chip stacking packaging;Equipped with a swinging and rotating mechanism and a flipping mechanism, the equipment can be compatible with two different mounting processes: forward and reverse. Equipped with UplookAlign and Postbond functions, the Postbond function supports real-time dynamic detection and compensation, further ensuring the accuracy and stability of product placement.

自動(dòng)調(diào)寬與升降，封裝無(wú)憂慮

支持軌道寬度自動(dòng)調(diào)節(jié)，以兼容不同寬度的載板。軌道平臺(tái)擁有基準(zhǔn)高度調(diào)節(jié)和快速升降功能，分別用于堆疊封裝時(shí)的高度自動(dòng)調(diào)整和有加熱需求時(shí)的過(guò)熱脫離。

Support automatic adjustment of track width to be compatible with carrier plates of different widths. The track platform has reference height adjustment and fast lifting functions, which are used for automatic height adjustment during stacking packaging and overheating detachment when there is a heating demand.

多尺寸兼容，快換治具任你選

兼容性強(qiáng)，可快換治具兼容6吋、8吋和12吋晶圓，也可使用快換治具兼容華夫盤(pán)或Gelpack上料。

Strong compatibility, quick change fixtures are compatible with 6 inch, 8 inch, and 12 inch wafers, and can also be used for wafer or Gelpack loading.

多元配置，工藝需求無(wú)遺漏

前軌道支持正裝中轉(zhuǎn)、反裝蘸膠、下相機(jī)對(duì)位等多種配置，以適配客戶不同的工藝需求。

The front track supports various configurations such as forward transfer, reverse dip glue, and lower camera alignment to meet the different process requirements of customers.

多段電流保護(hù)，快速穩(wěn)定

載板壓板和載板夾爪采用多段電流控制系統(tǒng)，在保證快速下壓和快速夾緊的同時(shí)，有效降低對(duì)載板的沖擊。

The load plate pressing plate and load plate clamping claw adopt a multi-stage current control system, which ensures fast pressing and clamping while effectively reducing the impact on the load plate.

創(chuàng)新設(shè)計(jì)，高效便捷

助焊劑大小及厚度通過(guò)前方的槽大小及深度控制，助焊劑刷取板采用無(wú)螺釘設(shè)計(jì)，可以通過(guò)拉取直接實(shí)現(xiàn)快換；同時(shí)，高慣量比動(dòng)力，可實(shí)現(xiàn)每小時(shí)3000次助焊劉送料。

The size and thickness of the flux are controlled by the size and depth of the groove in front, and the flux brush plate adopts a screwless design, which can be directly replaced by pulling; High inertia ratio power, able to achieve 3000 times of auxiliary welding and feeding per hour.

智能感應(yīng)，適應(yīng)面廣

助焊劑倉(cāng)帶缺料感應(yīng)裝置，當(dāng)助焊刻所剩量不足時(shí)，會(huì)閃爍黃燈并在人機(jī)窗口提醒人工注入助焊刻；其中蘸膠最小0.5*0.5mm，最大20*20mm。

The flux bin is equipped with a shortage sensing device. When the remaining amount of flux is insufficient, a yellow light will flash and remind manual injection of flux in the human-machine window; The minimum amount of glue dipped is 0.5 * 0.5mm, and the maximum amount is 20 * 20mm.

自定義路徑，滿足需求，點(diǎn)膠更靈活

自研自定義點(diǎn)膠路徑編輯系統(tǒng)，客戶可根據(jù)實(shí)際需求繪制所需畫(huà)膠路徑。

Self developed custom dispensing path editing system, allowing customers to draw the desired dispensing path according to their actual needs.

貼合相機(jī)模塊，熱親和與柔性設(shè)計(jì)，氣冷精準(zhǔn)定位

移動(dòng)支座和位置檢測(cè)部分采用熱親和設(shè)計(jì)和柔性設(shè)計(jì)，極大程度避免了由溫變導(dǎo)致的精度丟失，同時(shí)加裝了氣冷流道裝置，進(jìn)一步降低溫升，以保證對(duì)位精度。

The mobile support and position detection parts adopt a hot affinity design and flexible design, greatly avoiding accuracy loss caused by temperature changes. At the same time, an air-cooled flow channel device is installed to further reduce temperature rise and ensure alignment accuracy.

降低誤差，精準(zhǔn)貼合

邦頭水平移動(dòng)結(jié)構(gòu)的支座和位置檢測(cè)部分采用熱親和設(shè)計(jì)和柔性設(shè)計(jì)，降低了電機(jī)溫升帶來(lái)的誤差，保證了貼合精度。

The support and position detection part of the Bangtou horizontal moving structure adopts a hot affinity design and flexible design, reducing the error caused by motor temperature rise and ensuring the fitting accuracy.

精準(zhǔn)力控，自適應(yīng)軟著陸

自適應(yīng)軟著陸式邦頭力控系統(tǒng)，確保邦頭在快速拾取+貼合的同時(shí)，消除拾取和貼合過(guò)程中速度變化帶來(lái)的沖擊，從而確保拾取和貼合力的精度，在250gf以下力控誤差低于5%。

The adaptive soft landing type bond head force control system ensures that the bond head can quickly pick up and fit, while eliminating the impact caused by speed changes during the picking and fitting process, thereby ensuring the accuracy of the picking and fitting force. The force control error is less than 5% below 250gf.

精準(zhǔn)調(diào)節(jié)，完美貼合

Bondhead 齒輪式水平調(diào)節(jié)裝置調(diào)節(jié)水平如同上發(fā)條一樣便捷與精準(zhǔn);保證貼合面完全與貼合基準(zhǔn)面重合，完成對(duì)超薄芯片的無(wú)損貼合。

The level adjustment device of the Bondhead gear type is as convenient and accurate as the upper spring for adjusting the level; Ensure that the bonding surface completely overlaps with the bonding reference plane, completing non-destructive bonding of ultra-thin chips.

輕擺臂+鑄鐵支撐，振動(dòng)小，取放快

輕量化擺臂+鑄鐵支撐立柱，保證了高頻快速取放料的同時(shí)，有效降低了高速擺臂造成的振動(dòng)，確保了設(shè)備的整體穩(wěn)定性。

The lightweight swing arm and cast iron support column ensure high frequency and fast material collection and discharge, while effectively reducing the vibration caused by high-speed swing arms, ensuring the overall stability of the equipment.

直驅(qū)頂針，精度更高，響應(yīng)更快

直驅(qū)式頂針機(jī)構(gòu)，相對(duì)凸輪機(jī)構(gòu)精度更高，響應(yīng)更迅速，且其頂出距離，頂出高度，頂出速度均可設(shè)置。

The direct drive ejector pin mechanism has higher accuracy and faster response compared to the cam mechanism, and its ejection distance, ejection height, and ejection speed can be set.

雙驅(qū)動(dòng)協(xié)同，精確微距，高效保護(hù)

雙驅(qū)動(dòng)裝置，可使頂針與頂針吸盤(pán)獨(dú)立進(jìn)行微距運(yùn)動(dòng)，相互配合下，能有效保護(hù)產(chǎn)品，提高生產(chǎn)效率。

The dual drive device allows the ejector pin and ejector pin suction cup to independently move at a macro distance, and in combination, it can effectively protect the product and improve production efficiency.

多頂方案，超薄無(wú)憂

當(dāng)需要分離超薄芯片時(shí)，頭部可更換為多級(jí)頂針剝離裝置，最小可剝離30um厚度芯片。

When it is necessary to separate ultra-thin chips, the head can be replaced with a multi-level ejector pin stripping device, which can strip chips with a minimum thickness of 30um.

設(shè)備外形

Equipment appearance